微器件自動(dòng)裝配系統(tǒng)的定標(biāo)和操縱設(shè)計(jì)

主要研究了自動(dòng)微器件裝配系統(tǒng)的定標(biāo)技術(shù)和操縱策略兩個(gè)問(wèn)題. 在加入了尺度因子優(yōu)化步驟之后,一種基于Tsai 兩步法的自定標(biāo)方法實(shí)現(xiàn)了亞微米級(jí)的定標(biāo)精度,并且獲得了更加可信的定標(biāo)角度參數(shù). 這種定標(biāo)方法應(yīng)用于微器件裝配系統(tǒng)中并可以實(shí)現(xiàn)高精度的微器件定位. 除了精確定標(biāo)之外,我們還應(yīng)該選擇合適的工作環(huán)境來(lái)控制粘附力的大小來(lái)提高微器件操縱成功率,選擇合適的夾持和釋放方式來(lái)提高微器件操縱效率和釋放位置精度,選擇一種安全簡(jiǎn)單的移動(dòng)路徑來(lái)縮短移動(dòng)時(shí)間. 實(shí)驗(yàn)表明,我們的自動(dòng)微器件裝配系統(tǒng)可以在10 s 內(nèi)完成一個(gè)器件的定位和移動(dòng)操作,并實(shí)現(xiàn)數(shù)微米的釋放位置精度.

:An automated micro assembly system is presented here. A new self2calibration method with scale factor optimization steps based on Tsai ’s two stage algorithm is applied to calibrate our system. Sub2micron in plane cali bration accuracy and more believable calibration angles can be achieved by our calibration method. A suitable envi2 ronment may facilitate the handling operation because the adhesion forces between micro object s are affected by en vironmental parameters obviously. The pick and release strategies also affect the handling efficiency and micro ob ject positioning accuracy. More attention should be paid on them. Our automated micro assembly system can locate and handle a micro part within 10 seconds with a positioning accuracy of several microns.